CWE-1248: Semiconductor Defects in Hardware Logic with Security-Sensitive Implications
A semiconductor device can fail for various reasons. While some are manufacturing and packaging defects, the rest are due to prolonged use or usage under extreme conditions. Some mechanisms that lead to semiconductor defects include encapsulation failure, die-attach failure, wire-bond failure, bulk-silicon defects, oxide-layer faults, aluminum-metal faults (including electromigration, corrosion of aluminum, etc.), and thermal/electrical stress. These defects manifest as faults on chip-internal signals or registers, have the effect of inputs, outputs, or intermediate signals being always 0 or always 1, and do not switch as expected. If such faults occur in security-sensitive hardware modules, the security objectives of the hardware module may be compromised.
Modes of Introduction
| Phase | Note |
|---|---|
| Manufacturing | May be introduced due to issues in the manufacturing environment or improper handling of components, for example. |
| Operation | May be introduced by improper handling or usage outside of rated operating environments (temperature, humidity, etc.) |
Applicable Platforms
| Type | Class | Name | Prevalence |
|---|---|---|---|
| Language | Not Language-Specific | ||
| Operating_system | Not OS-Specific | ||
| Architecture | Not Architecture-Specific | ||
| Technology | Not Technology-Specific |
Common Attack Pattern Enumeration and Classification (CAPEC)
The Common Attack Pattern Enumeration and Classification (CAPEC™) effort provides a publicly available catalog of common attack patterns that helps users understand how adversaries exploit weaknesses in applications and other cyber-enabled capabilities.
CAPEC at Mitre.org